Semiconductor Research Corporation (SRC) is soliciting white papers in the areas of Computer-Aided Design and Test (CADT), Logic and Memory Devices (LMD), AI Hardware (AIHW), Packaging (PKG) and Packaging “CHIRP” (PKG CHIRP).

Please note that white papers addressing the needs in the corresponding Research Needs documents are to be uploaded by the deadline noted in each solicitation timeline. Each researcher may be involved in no more than two submissions per call. A selected white paper will result in an invitation to submit a full proposal for further consideration for a research contract.

The white paper solicitations, needs documents, and instructions for submissions can be found at:

• Computer-Aided Design and Test (deadline Tuesday, July 2, 2019)
• Logic and Memory Devices (deadline Tuesday, July 9, 2019)
• AI Hardware (deadline Wednesday, July 3, 2019)
• Packaging (deadline Monday, July 1, 2019
• Packaging (CHIRP) (deadline Monday, July 8, 2019)

If you are interesting in applying for this funding opportunity, please contact OSRP.