Tech Futures – FDSN will be exhibiting at PACK EXPO International 2026, taking place October 18-21, 2026. Student volunteers are sought to assist with booth coverage throughout the entire event.

This is an excellent opportunity to expand your professional network, connect with industry leaders, and explore potential internship and career opportunities within the packaging, food, and related industries.

If you are interested in volunteering, please contact Cindy Koschetz at ckoschet@illinoistech.edu and provide your availability based on your class schedule.

Additional information about the event can be found here: https://www.packexpointernational.com/