Armour College Ph.D. Students in IIT-Material Advantage Chapter Make Technical Presentations at MS&T 2015

20151005_170649_news.jpgSeveral Armour College of Engineering students who are members of Illinois Tech’s Material Advantage Chapter participated in Materials Science and Technology 2015 (MS&T 2015) from October 4-8 in Columbus, Ohio. The Armour students highlighted below co-authored papers and made technical presentations at the international conference.

  1. “Core-Shell Silicon Nanoparticles with Different Coatings as Future Anode Material for Lithium-Ion Batteries” co-authored by Maziar Ashuri (Ph.D. Student, Material Science and Engineering), Qianran He (Ph.D. Student, Material Science and Engineering), Kan Zhang,  Satyanarayana Emani, Monica Sawicki (Ph.D. Student, Material Science and Engineering), Jack Shamie (Ph.D. Student, Material Science and Engineering), and Leon Shaw.
  2. “High Speed Additive Manufacturing through a Novel Concept of High Aspect Ratio Nozzles” co-authored by Jie Li (Ph.D. Student, Material Science and Engineering), Mashfiqul Islam, Ling Li (Ph.D.  Student, Material Science and Engineering), S. M. Imran Ayub and Leon Shaw.
  3. “3D printing of Gas Diffusion Layers with Separate Gas and Water Pathways for PEMFCs” co-authored by Qianran He (Ph.D. Student, Material Science and Engineering), Jie Li (Ph.D. Material Science and Engineering), Ling Li (Ph.D. Student, Material Science and Engineering), and Leon Shaw.
  4. “The effect of a substitutional element Z (Z = Al, Ga, In, Si, Ge) on the standard enthalpies of formation of the Heusler compound Ni2MnSn” co-authored by Ming Yin (Ph.D. Student, Material Science and Engineering) and Philip Nash.

In addition to presenting at the conference, students participated in the Mug Drop contest, served as student aids and established connections at the Student Networking Mixer. The group is mentored by Leon Shaw, Rowe Family Professor of Materials Science and Engineering, who also co-authored three of the papers and accompanied the students to the conference.