Future of Semiconductors – Teaming for Co-Design Research Capacity (FuSe Teaming Grants) (FuSe)
The goal of this solicitation is to cultivate a broad coalition of researchers from across science and engineering communities to utilize a holistic, co-design approach to fundamental research and education and training, to enable rapid progress in new semiconductor technologies. Proposals are sought to support team-formation to articulate co-design visions for the future.
Initially, team formation is directed to the following three research areas identified for support in FY 2022 under this solicitation:
- Collaborative Research in Domain-Specific Computing
- Advancing Function and Achieving High-Performance from Heterointegration
- New Materials for Energy Efficient, Enhanced-performance and Sustainable Semiconductor-based Systems
Awards will provide up to two years of support for up to $100,000 per participating organization on the proposal with a minimum of three organizations. Proposals can address any of the three topic areas above, or another research problem requiring co-design in the broad area of semiconductors.
Read the full program solicitation here.
The Office of Sponsored Research and Programs requests that your proposal be submitted to the team no later than five days prior to the sponsor deadline. Your work is a priority to the OSRP staff, but please understand the team helps prepare many proposals at the same time and must give careful review to each one. Email firstname.lastname@example.org for help with your proposal or any questions you have.